Well, that didn’t take long did it?

Not even 2 months into the launch of the 6S and 6S Plus the rumours are already circulating about what Apple has planned for the iPhone 7 and & Plus - assuming that's what they will be called.

As always, we stress that these are just that – rumours – but we like a bit of speculation as much as the next person so here is a summary of the current rumours doing the rounds:

• Thickness: between 6-6.5mm, about 1mm thinner than current models
• Chip: A10 built by TSMC, the same company that made a number of the A9 chips for the 6S/6S Plus
• Processing power: 2GB RAM for the 7 and 3GB for the 7 Plus
• Body: waterproof and dust proof; non-metal casing

As always, we will continue to keep our ear to the rumour mill to keep you all informed, but shoot us a line if you hear of any exciting developments!